APPARATUS AND METHOD FOR TESTING OPERATION PERFORMANCE OF AN ELECTRONIC MODULE UNDER SPECIFIED TEMPERATURE
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United States of America Patent
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Issued Date -
Jan 31, 2013
app pub date -
Aug 25, 2011
filing date -
Jul 29, 2011
priority date (Note) -
Abandoned
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Abstract
An apparatus includes a predetermined function circuit board having a primary area for accepting an electronic module to be tested, a secondary area coupled electrically with the primary area, and one cooperation electronic module installed on the secondary area and coupled electrically to the electronic module to define a predetermined function circuit. A thermal insulation device is installed in the primary area and is formed with a thermal insulation chamber for accepting the electronic module and thermally insulating the electronic module from the cooperation electronic module. A thermal control chip is disposed to control a testing temperature of the insulation chamber TIC, thereby providing a testing environment. The electronic module is electrically connected to the apparatus upon the predetermined function circuit performs a predetermined function, thereby carrying out the testing of the operation performance of the tested electronic module within the thermal insulation chamber TIC under a specified temperature.
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