LIQUID EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION, AND SEMICONDUCTOR DEVICE USING THE SAME
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United States of America Patent
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Issued Date -
Jan 31, 2013
app pub date -
Jul 29, 2011
filing date -
Jul 29, 2011
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Abstract
A liquid epoxy resin composition for semiconductor encapsulation comprising: (A) an epoxy resin, (B) an imidazole compound, and (C) a maleimide compound, a semiconductor device encapsulated by the liquid epoxy resin composition, and an assembly in which a cured material of the liquid epoxy resin is positioned between a printed circuit substrate and a semiconductor die.
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