SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE STRUCTURE CONFIGURED BY VERTICALLY STACKING SEMICONDUCTOR DEVICES, AND MANUFACTURING METHOD THEREOF
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United States of America Patent
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Issued Date -
Jan 31, 2013
app pub date -
Jul 24, 2012
filing date -
Jul 28, 2011
priority date (Note) -
Abandoned
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Abstract
A semiconductor device is made up of an organic substrate; through vias which penetrate the organic substrate in its thickness direction; external electrodes and internal electrodes provided to the front and back faces of the organic substrate and electrically connected to the through vias; a semiconductor element mounted on one main surface of the organic substrate via a bonding layer, with an element circuit surface thereof facing upward; an insulating material layer for sealing the semiconductor element and a periphery thereof; a metal thin film wiring layer provided in the insulating material layer, with a part of this metal thin film wiring layer being exposed on an external surface; metal vias provided in the insulating material layer and electrically connected to the metal thin film wiring layer; and external electrodes formed on the metal thin film wiring layer.
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