Bonding tool, electronic component mounting apparatus, and manufacturing method of bonding tool
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United States of America Patent
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Mar 10, 2015
Grant Date -
Jan 31, 2013
app pub date -
Apr 12, 2011
filing date -
May 20, 2010
priority date (Note) -
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Abstract
In some cases, it is difficult to carry out ultrasonic joining of high quality with a conventional bonding tool. A bonding tool includes: a horn that transmits an ultrasonic vibration; an ultrasonic vibrator that is provided at one end of the horn, and generates the ultrasonic vibration; and an electronic component holding part that holds an electronic component, wherein the electronic component holding part has a male fitting part in a shape of a tapering-off, and an electronic component holding face that holds the electronic component on an opposite side to the male fitting part, a female fitting part in a shape according to a shape of the male fitting part is formed in a predetermined face of the horn, and the male fitting part is fitted into the female fitting part via an adhesion layer.
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