COPPER OXIDE ETCHANT AND ETCHING METHOD USING THE SAME

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United States of America Patent

APP PUB NO 20130026134A1
SERIAL NO

13579490

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Abstract

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In order to provide a copper oxide etchant and an etching method using the same capable of selectively etching exposure/non-exposure portions when laser light exposure is performed by using copper oxide as a thermal-reactive resist material, the copper oxide etchant for selectively etching copper oxides having different oxidation numbers in a copper oxide-containing layer containing the copper oxide as a main component contains at least a chelating agent or salts thereof.

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Patent Owner(s)

Patent OwnerAddress
ASAHI KASEI E-MATERIALS CORPORATION1-105 KANDA JINBOCHO CHIYODA-KU TOKYO 101-8101

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Mitamura, Yoshimichi Tokyo, JP 13 212
Nakagawa, Norikiyo Tokyo, JP 6 66
Nakata, Takuto Tokyo, JP 8 52

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