HYPODERMIC NEEDLE RECAPPER
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United States of America Patent
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Issued Date -
Jan 24, 2013
app pub date -
Jun 4, 2012
filing date -
Jul 22, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A hypodermic needle recapper, comprising a substantially planar substrate formed of a given material and having a given thickness which, in combination, cause the substrate to be substantially impervious to penetration of a hypodermic needle. The substrate defining an opening having a flexible perimeter adapted to admit a hypodermic needle cap therein and having a plurality of flexible flaps formed about a periphery of the opening so as to provide the flexibility to the perimeter of the opening. Each flap has a thickness that is less than the given thickness of the substrate.
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