METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

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United States of America Patent

SERIAL NO

13550119

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Abstract

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A method for manufacturing a MOSFET includes the steps of: introducing an impurity into a silicon carbide layer; forming a carbon layer in a surface layer portion of the silicon carbide layer having the impurity introduced therein, by selectively removing silicon from the surface layer portion; and activating the impurity by heating the silicon carbide layer having the carbon layer formed therein.

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Patent Owner(s)

Patent OwnerAddress
SUMITOMO ELECTRIC INDUSTRIES LTDOSAKA-SHI OSAKA 541-0041
NATIONAL UNIVERSITY CORPORATION NARA INSTITUTE OF SCIENCE AND TECHNOLOGYIKOMA-SHI NARA 630-0192

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hatayama, Tomoaki Ikoma-shi, JP 10 152
Masuda, Takeyoshi Osaka-shi, JP 168 1814

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