PRINTED CIRCUIT BOARD HAVING HEAT GATHERING STRUCTURES AND MANUFACTURING PROCESS THEREOF
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jan 17, 2013
app pub date -
Nov 9, 2011
filing date -
Jul 15, 2011
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A printed circuit board (PCB) having heat gathering structures is used for enabling electronic components with pins to be inserted thereon. The PCB includes a base, at least one insertion hole, and at least one heat gathering hole. The base has a first surface and a second surface. The insertion hole penetrates the base, and the base has soldering pad on the periphery of the insertion hole. A first electric conducting layer is disposed on the inner wall of each insertion hole. The heat gathering hole penetrates the base. A second electric conducting layer is disposed on the inner wall of each heat gathering hole. The temperature of the insert holes will be increased for improving soldering process. A manufacturing process of the PCB having heat gathering structures is also disclosed.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully