ELECTRONIC PACKAGE WITH THERMAL VIAS, AND FABRICATION PROCESS
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United States of America Patent
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Issued Date -
Jan 17, 2013
app pub date -
Jul 13, 2012
filing date -
Jul 13, 2011
priority date (Note) -
Abandoned
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Abstract
An electronic package includes at least one heat-transfer element interposed between a front side of an integrated-circuit chip and a back side of a heat-transfer plate. An encapsulation block has a portion lying between the front side of the integrated-circuit chip and the back side of the heat-transfer plate. The portion embeds the heat-transfer element. Another heat transfer element is interposed between a front side of a electrical-connection support plate and a rim portion of the heat-transfer plate.
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