FILM PEELING APPARATUS AND FILM PEELING METHOD
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United States of America Patent
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app pub date -
Jul 12, 2012
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Jul 14, 2011
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Abstract
An ultrashort pulsed laser beam, the fluence of which on an interface BF is set to be larger than a substrate processing threshold and smaller than a film processing threshold, is irradiated to the interface BF via a thin film F. Thus, in a laser irradiated portion of the interface BF, the substrate W is selectively processed, bonding between the substrate and the thin film F is reduced and the thin film F is peeled.
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