Biaxial Drive Mechanism and Die Bonder
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United States of America Patent
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Issued Date -
Jan 17, 2013
app pub date -
Sep 6, 2011
filing date -
Jul 15, 2011
priority date (Note) -
Abandoned
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Abstract
A biaxial drive mechanism including a Z axis capable of realizing a high speed elevation axis without an increment in torque on a horizontal drive axes and a die bonder using the biaxial drive mechanism is disclosed. The biaxial drive mechanism includes a handling part; a first linear motor having a first movable part that moves up/down the handling part and a first stationary part; a second linear motor having a second movable part and a second stationary part; a connecting part that directly or indirectly connects the first movable part to the second movable part via the first linear guide; a second linear guide that moves the first movable part; and a support body that fixes the first stationary part and the second stationary part with a predetermined length in parallel to each other in the horizontal direction.
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