Saw For Cutting Silicon Into Seed Rods For Use In A Chemical Vapor Deposition Polysilicon Reactor

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United States of America Patent

APP PUB NO 20130014738A1
SERIAL NO

13545093

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Abstract

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Systems and methods are provided for cutting silicon into seed rods for use in a chemical vapor deposition polysilicon reactor. A method includes cutting the silicon ingot with saw blades into silicon slabs, rotating the silicon slabs, and cutting the silicon slabs into smaller-sized silicon seed rods for use in the chemical vapor deposition polysilicon reactor.

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Patent Owner(s)

Patent OwnerAddress
MEMC ELECTRONIC MATERIALS S P A28100 NOVARA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bovo, Rodolfo Bolzano, IT 7 28
Molino, Paolo Lana, IT 4 26

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