DEVICE HAVING AND METHOD FOR FORMING FINS WITH MULTIPLE WIDTHS

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United States of America Patent

SERIAL NO

13617280

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Abstract

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A method for fabrication of features for an integrated circuit includes patterning a mandrel layer to include structures having a plurality of different widths on a surface of an integrated circuit device. Exposed sidewalls of the structures are reacted to integrally form a new compound in the sidewalls such that the new compound extends into the exposed sidewalls by a controlled amount to form pillars. One or more layers below the pillars are etched using the pillars as an etch mask to form features for an integrated circuit device.

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Patent Owner(s)

Patent OwnerAddress
AURIGA INNOVATIONS INC303 TERRY FOX DRIVE SUITE 300 OTTAWA K2K 3J1

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHENG, KANGGUO ALBANY, US 3099 32749
DORIS, BRUCE B ALBANY, US 797 13759
HOLMES, STEVEN J HOPEWELL JUNCTION, US 316 5799
HUA, XUEFENG GUILDERLAND, US 19 261
ZHANG, YING YORKTOWN HEIGHTS, US 923 12176

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