STRUCTURE FOR MICROELECTRONICS AND MICROSYSTEM AND MANUFACTURING PROCESS
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jan 10, 2013
app pub date -
Sep 14, 2012
filing date -
Sep 30, 2004
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A process for making cavities in a multilayer structure by providing a multilayer structure that includes a surface layer, a planar support substrate and a buried layer between the layer and the support substrate, wherein the buried layer comprises areas of first and second materials with the first material having a higher etching rate than the second material; producing an opening in the surface layer that extends to the area(s) of the first material of the buried layer; and etching the first material to form at least one cavity in the buried layer.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully