BOND LINE THICKNESS CONTROL FOR DIE ATTACHMENT
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United States of America Patent
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Issued Date -
Jan 10, 2013
app pub date -
Jul 7, 2011
filing date -
Jul 7, 2011
priority date (Note) -
Abandoned
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Abstract
A semiconductor die is attached onto a substrate on a process platform during manufacturing of a semiconductor package. A dispenser dispenses an adhesive onto the substrate, and the semiconductor die is bonded onto the adhesive which has been dispensed onto the substrate with a bonding tool. Thereafter, a bond line thickness between a bottom surface of the semiconductor die and a top surface of the substrate on the process platform is measured using a measuring device.
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