Importance

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Abstract

Disclosed is a multi-chip package having leadframe-type contact fingers, primarily comprising a leadframe, a non-conductive tape, a first chip and a second chip disposed on the first chip. The leadframe includes a die paddle on which the first chip is disposed and a plurality of first contact fingers, moreover, at least a second contact finger is integrally extended from the die paddle and is located among the first contact fingers so that the first and second contact fingers are arranged in a row. The non-conductive tape is attached onto the first and second contact fingers conforming to the arranging row of the first contact fingers so that the second contact finger is mechanically fastened with the first contact fingers. An encapsulant encapsulates the first chip, the second chip and the non-conductive tape with a plated metal layer formed on the bottom surfaces of the first and second contact fingers and exposed from the encapsulant. Accordingly, delamination of the conventional substrate or a die paddle can be avoided and the amount of tie bars used can be decreased.

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First Claim