ALIGNMENT MARKS AND ALIGNMENT METHODS FOR ALIGNING BACKSIDE COMPONENTS TO FRONTSIDE COMPONENTS IN INTEGRATED CIRCUITS
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United States of America Patent
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Issued Date -
Jan 10, 2013
app pub date -
Dec 2, 2011
filing date -
Jul 7, 2011
priority date (Note) -
Abandoned
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Abstract
An imaging system may include an imager integrated circuit with frontside components such as imaging pixels and backside components. The imager integrated circuit may also include mirrored alignment marks formed with the frontside components. As part of forming the backside components, the integrated circuit may be flipped over such that the mirrored alignment marks are no longer mirrored and are readable by alignment systems. The formerly mirrored alignment marks may be used by the alignment systems in aligning the backside components with the frontside components in the imager integrated circuit (e.g., in forming the backside components in alignment with the frontside components).
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