APPARATUS FOR TREATING A WAFER-SHAPED ARTICLE
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United States of America Patent
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Issued Date -
Jan 10, 2013
app pub date -
Jul 7, 2011
filing date -
Jul 7, 2011
priority date (Note) -
Abandoned
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Abstract
An apparatus for processing wafer-shaped articles comprises a closed process chamber, a chuck located within the closed process chamber, and at least one process liquid dispensing device disposed within the chamber. The closed process chamber comprises a lid that can be opened to position a wafer-shaped article within the closed process chamber. The lid incorporates a heater adapted to heat a wafer-shaped article positioned in the closed process chamber.
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