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United States of America Patent

APP PUB NO 20130002039A1
SERIAL NO

13582586

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A receiving unit portion and a transmission unit portion are brought close to each other. Then, when upper end surfaces of protrusions (18BD) are brought into contact with a surface of a reception side wiring board (30A) at a given pressure attributed to an elastic force of a flexible wiring board (18B), a gap between an electrode pad (18bi) and an electrode pad (30ai) is limited at a predetermined value by the protrusions (18BD).

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Patent Owner(s)

Patent OwnerAddress
YAMAICHI ELECTRONICS CO LTD2-16-2 MINAMIKAMATA OTA-KU TOKYO 144-8581

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kusamitsu, Hideki Tokyo, JP 6 118

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