PACKAGE AND METHOD FOR MANUFACTURING PACKAGE
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United States of America Patent
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N/A
Issued Date -
Jan 3, 2013
app pub date -
Jun 27, 2012
filing date -
Jun 28, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method for manufacturing a package, includes preparing a substrate having a first surface on which a connecting pad is formed, mounting a sacrificing material on the connecting pad, forming a package portion covering the first surface of the substrate, exposing the sacrificing material from a surface of the package portion, and removing the exposed sacrificing material from the side of the surface of the package portion, and forming an opening portion in the package portion on the connecting pad.
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