HEAT SPREADER FOR THERMALLY ENHANCED FLIP-CHIP BALL GRID ARRAY PACKAGE
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United States of America Patent
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Issued Date -
Jan 3, 2013
app pub date -
Jun 30, 2011
filing date -
Jun 30, 2011
priority date (Note) -
Abandoned
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Abstract
A heat spreader is provided for use with a thermally enhanced flip-chip ball grid array package. In the package, a semiconductor die is positioned front-side down on a package substrate, coupled thereto via solder balls. Passive devices can also be coupled to the substrate alongside the die. The heat spreader is positioned over the substrate and die, in thermal contact with the die. A projection in the center of the heat spreader makes contact with the back surface of the die via a thermal interface material, to draw heat from the die for improved cooling. The projection enables close contact with a thinned die while accommodating thicker passive devices positioned around the die on the substrate.
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