LIGHT-EMITTING ELEMENT MOUNTING SUBSTRATE, LED PACKAGE AND METHOD OF MANUFACTURING THE LED PACKAGE
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United States of America Patent
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Issued Date -
Jan 3, 2013
app pub date -
Jun 11, 2012
filing date -
Jun 29, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A light-emitting element mounting substrate includes an insulative substrate, a pair of wiring patterns formed on one surface of the substrate, and a pair of filled portions including a metal filled in a pair of through-holes to contact the pair of wiring patterns and to be exposed on a surface of the substrate opposite to the one surface, the pair of through-holes penetrating through the substrate in a thickness direction. The pair of filled portions includes a protruding portion that protrudes outward from the pair of wiring patterns when viewed from the one surface side of the substrate.
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