LIGHT-EMITTING APPARATUS AND MANUFACTURING METHOD THEREOF
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United States of America Patent
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Issued Date -
Jan 3, 2013
app pub date -
Jun 28, 2012
filing date -
Jul 1, 2011
priority date (Note) -
Abandoned
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Abstract
A light-emitting apparatus includes a substrate, at least one light emitting diode (LED) die, a sealant align layer, and a first sealant. The substrate has a die disposing area. The LED die is disposed on the die disposing area. The sealant align layer is disposed on the substrate. The first sealant at least partially covers the LED die and contacts with the sealant align layer. The light-emitting apparatus can avoid the light emitted from the LED die to be blocked and can have higher light efficiency.
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