LIGHT-EMITTING ELEMENT MOUNTING SUBSTRATE AND LED PACKAGE
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United States of America Patent
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Issued Date -
Jan 3, 2013
app pub date -
Jun 11, 2012
filing date -
Jun 29, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A light-emitting element mounting substrate includes an insulative substrate including a single-sided printed circuit board, a pair of wiring patterns formed on one surface of the substrate, the wiring patterns being separated with a first distance, a pair of through-holes penetrating through the substrate in a thickness direction, the through-holes being separated with a second distance, and a pair of filled portions including a metal filled in the pair of through-holes to contact the pair of wiring patterns and to be exposed on a surface of the substrate opposite to the one surface. Each of the pair of filled portions has a horizontal projected area of not less than 50% of an area of each the pair of wiring patterns.
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