WIRING BOARD AND MANUFACTURING METHOD OF THE SAME

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United States of America Patent

SERIAL NO

13611472

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A wiring board includes a main body, a piercing electrode piercing the main body, a first wiring pattern provided at a first surface side of the main body, the first wiring pattern having a pad being electrically connected to one end of the piercing electrode and being where an electronic component is mounted, and a second wiring pattern provided at a second surface side of the main body, the second surface side being situated at a side opposite to the first surface side, the second wiring pattern having an external connection pad being electrically connected to another end of the piercing electrode. A recess and a resin covering the recess are provided at an external circumferential part of the wiring board to surround the first and second wiring patterns and the piercing electrode, the recess piercing the main body of a part positioned at the external circumferential part.

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Patent Owner(s)

Patent OwnerAddress
SHINKO ELECTRIC INDUSTRIES CO LTDNAGANO

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
SAKAGUCHI, Hideaki Nagano-shi, JP 110 1476
Shiraishi, Akinori Nagano-shi, JP 80 1156

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