Abrasive Particles for Chemical Mechanical Polishing
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United States of America Patent
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app pub date -
Dec 22, 2011
filing date -
Jan 11, 2006
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Abandoned
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Abstract
An abrasive composition for polishing substrates including a plurality of abrasive particles having a poly-dispersed particle size distribution with median particle size, by volume, being about 20 nanometers to about 100 nanometers; a span value, by volume, being greater than or equal to about 15 nanometers, wherein the fraction of particles greater than about 100 nanometers is less than or equal to about 20% by volume of the abrasive particles.
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