BUSBAR CONTACT PAD WITH SPECIFIC CURVATURE FOR A BETTER CONNECTION TO METAL SPRAY LAYERS
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United States of America Patent
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Issued Date -
Dec 27, 2012
app pub date -
Jun 22, 2012
filing date -
Jun 22, 2011
priority date (Note) -
Abandoned
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Abstract
Current busbar pad designs are based on a flat busbar surface to be connected to the metal spray layer of the film capacitor. Busbar pads with a special concave curvature allow better connections to metal spray layer surfaces in regard to mechanical adherence and an improved solder tin distribution at the interface. Best performance can be achieved in combination with flux.
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