SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND METHOD FOR REDUCING MICROROUGHNESS OF SEMICONDUCTOR SURFACE

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United States of America Patent

SERIAL NO

13601157

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Abstract

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Surface treatment is performed with a liquid, while shielding a semiconductor surface from light. When the method is employed for surface treatment in wet processes such as cleaning, etching and development of the semiconductor surface, increase of surface microroughness can be reduced. Thus, electrical characteristics and yield of the semiconductor device are improved.

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TOHOKU UNIVERSITY FOUNDATION FOR ADVANCEMENT OF INTERNATIONAL SCIENCENot Provided

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Morinaga, Hitoshi Miyagi, JP 68 521
Ohmi, Tadahiro Miyagi, JP 798 14083

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