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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
SUMCO CORPORATION	1-2-1 SHIBAURA MINATO-KU TOKYO 105-8634

International Classification(s)

• H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

• 2012 Application Filing Year
• H01L Class
• 20465 Applications Filed
• 18077 Patents Issued To-Date
• 88.34 % Issued To-Date

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Kurita, Kazunari	Tokyo, JP	51	271
# of filed Patents : 51 Total Citations : 271
Omote, Shuichi	Tokyo, JP	12	46
# of filed Patents : 12 Total Citations : 46

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Patent Citation Ranking

• 2 Citation Count
• H01L Class

• 3.37 % this patent is cited more than
• 13 Age

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

Full Text

US Patent Application No: 2012/0329,204

WAFER FOR BACKSIDE ILLUMINATION TYPE SOLID IMAGING DEVICE, PRODUCTION METHOD THEREOF AND BACKSIDE ILLUMINATION SOLID IMAGING DEVICE

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Abstract

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A wafer for backside illumination type solid imaging device has a plurality of pixels inclusive of a photoelectric conversion device and a charge transfer transistor at its front surface side and a light receiving surface at its back surface side, wherein said wafer is a SOI wafer obtained by forming a given active layer on a support substrate made of C-containing p-type semiconductor material through an insulating layer.

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Description

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Claims

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