PACKAGE STRUCTURE OF TRANSIENT VOLTAGE SUPPRESSOR
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United States of America Patent
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N/A
Issued Date -
Dec 27, 2012
app pub date -
Jun 22, 2011
filing date -
Jun 22, 2011
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A package structure of transient voltage suppressor is disclosed. The package structure comprises a package housing with a bottom thereof having a first contact pin, a second contact pin, and a third contact pin, wherein the third contact pin is positioned between the first contact pin and the second contact pin. A first diode is positioned in the package housing, and an anode and a cathode of the first diode are respectively connected with the third contact pin and the first contact pin. A second diode is installed in the package housing, and an anode and a cathode of the second diode are respectively connected with the third contact pin and the second contact pin.
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