SEMICONDUCTOR DEVICE WITH ENCAPSULATED ELECTRICAL CONNECTION ELEMENTS AND FABRICATION PROCESS THEREOF
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United States of America Patent
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Issued Date -
Dec 27, 2012
app pub date -
Jun 15, 2012
filing date -
Jun 21, 2011
priority date (Note) -
Abandoned
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Abstract
An integrated-circuit chip and external electrical connection elements are arranged on a first side of a substrate to form an assembly that is placed within a mold. The mold includes first and second opposed planar faces with a molding film made of a deformable material on the first planar face. The molding film is pressed against end faces of the external electrical connection elements. Encapsulating material then fills the mold cavity producing a semiconductor device that, when removed from the mold, includes electrical connection elements that are peripherally coated by the encapsulating material and have exposed end faces. An additional semiconductor device may be mounted over and in electrical connection with the electrical connection elements through the exposed end faces.
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