POP PACKAGE AND MANUFACTURING METHOD THEREOF
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United States of America Patent
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Issued Date -
Dec 27, 2012
app pub date -
Dec 29, 2010
filing date -
Dec 29, 2009
priority date (Note) -
Abandoned
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Abstract
The present invention relates to a package on package (POP) package and a manufacturing method thereof, and provides a POP package and a manufacturing method thereof in which the POP package can be implemented by using a transfer mold method without employing a top gate mold method. To this end, the present invention comprises: a lower semiconductor package which includes a first solder ball and a semiconductor chip formed on the upper surface of a substrate, and a mold for molding the semiconductor chip and the solder ball so that a part of the first solder ball may be exposed; and an upper semiconductor package which is stacked so that a connection is made to an exposed part of a second solder ball through the second solder ball formed on the lower surface.
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