Externally Wire Bondable Chip Scale Package in a System-in-Package Module
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United States of America Patent
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Issued Date -
Dec 27, 2012
app pub date -
Jun 24, 2011
filing date -
Jun 24, 2011
priority date (Note) -
Abandoned
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Abstract
There is provided a system and method for an externally wire bondable chip scale package in a system-in-package module. There is provided a system-in-package module comprising a substrate including a first contact pad disposed thereon, a packaged device attached to the substrate, wherein an electrode of the packaged device is wirebonded to the first contact pad, and an unpackaged device, wherein an electrode of the unpackaged device is coupled to the substrate. By flipping the packaged device within the module and utilizing wire bondable finishes on the packaged device, an externally wire bondable chip scale package may be provided. The structure of the disclosed system-in-package module provides several advantages over conventional designs including increased yields, a single assembly line, facilitated die substitution, reduced heat stress, higher package density, and a simplified single package structure for reduced fabrication time and cost.
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