PRINTED CIRCUIT BOARD ASSEMBLY
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United States of America Patent
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N/A
Issued Date -
N/A
app pub date -
Sep 7, 2012
filing date -
Feb 27, 2008
priority date (Note) -
Abandoned
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Abstract
A printed circuit board assembly includes: a base material of printed boards; a solder pad formed on a pad-forming portion of the base material of printed boards and having a lead-coupling portion, a soldermask-covered portion, and an intermediate portion interposed therebetween; a soldermask having a solder pad-covering portion formed on the soldermask-covered portion of the solder pad and a remainder portion formed on the base material of printed boards; and a solder paste having one portion formed on the lead-coupling portion of the solder pad and attached to a lead of an electronic component, and the other portion formed on the intermediate portion of the solder pad, the solder pad-covering portion of the soldermask being substantially free of solder paste thereabove.
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