HEAT DISSIPATION DEVICE WITH FAN HOLDER
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United States of America Patent
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Issued Date -
Dec 27, 2012
app pub date -
Aug 23, 2011
filing date -
Jun 22, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A heat dissipation device adapted for dissipating heat generated by an electronic component mounted on a printed circuit board. The heat dissipation device includes a heat sink attached to the electronic component, a fan, and a fan holder. The fan includes a frame and a rotor received in the frame. The fan holder mounts the fan onto the heat sink and includes a base fixed on the heat sink, four clasps extending upward from four corners of a top surface of the base, and four elastic portions corresponding to the clasps and configured to resiliently urge the frame of the fan. The frame of the fan is arranged on the base of the fan holder and sandwiched between the clasps and the elastic portions.
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