Methods and apparatus for electrically modifying gel adhesion
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United States of America Patent
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Feb 24, 2015
Grant Date -
Dec 27, 2012
app pub date -
Aug 9, 2012
filing date -
Nov 1, 2004
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Abstract
The invention concerns a method for controlling the adhesive bond between an electric-field responsive material and a substrate, which method comprises using an electric field to control the strength and integrity of the adhesive bond. The method may be used, for example, for removing or delaminating a material, which material is responsive to an electric field, from a substrate. The invention further comprises elimination of the application of the electric field and application of the previously removed electric-field-responsive material to the substrate, thereby resuming the strength and integrity of the adhesive bond. The invention includes apparatus for use in the bond controlling process.
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