Plasma Processing Apparatus
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United States of America Patent
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Issued Date -
Dec 27, 2012
app pub date -
Feb 4, 2011
filing date -
Mar 15, 2010
priority date (Note) -
Abandoned
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Abstract
Disclosed is a plasma processing apparatus which performs plasma processing under substantially atmospheric pressure to a non-planar subject to be processed. In the plasma processing apparatus, a pair of conductive wires are disposed at an interval of 1 mm or less on a dielectric board that conforms with the shape of the subject, the conductive wires are covered with a dielectric thin film having a thickness of 1 mm or less by, for instance, thermally spraying a dielectric material over the conductive wires, and plasma is generated along the shape of subject by applying high-frequency power to the pair of conductive wires.
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