Antifungal Material
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United States of America Patent
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Issued Date -
Dec 20, 2012
app pub date -
Dec 24, 2009
filing date -
Dec 24, 2009
priority date (Note) -
Abandoned
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Abstract
The present invention relates to antifungal materials, particularly to nanoparticles comprising or consisting of a non-persistent inorganic support material such as Tricalciumphosphate (TCP) and copper as a dopant in the form of Cu+/−0, Cu+1 and or Cu+2; to composite materials or liquid formulations containing such nanoparticles. Further, the invention relates to the manufacture of such nanoparticles, composites, liquid formulations and to the use of such nanoparticles, composites, liquid formulations as an antifungal component.
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