HEAT DISSIPATION DEVICE WITH HEAT PIPE
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United States of America Patent
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N/A
Issued Date -
Dec 20, 2012
app pub date -
Aug 30, 2011
filing date -
Jun 17, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An exemplary heat dissipation device includes a heat pipe and a fin assembly. The heat pipe includes a main body and an end portion. The end portion has a width smaller than that of the main body. The fin assembly includes a first fin and a second fin adjoining to the first fin. The first fin forms a flange from a side of thereof. The second fin forms a flange from a side of thereof. The flange of the first fin has an extending portion overlapping and soldering to the flange of the second fin. The extending portion defines a number of through holes corresponding to the flange of the second fin. The end portion of the heat pipe is soldered to the extending portion of the first fin and soldered to the flange of the second fin by the through holes of the extending portion.
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