MANUFACTURING METHOD FOR SEMICONDUCTOR WAFER
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United States of America Patent
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Issued Date -
Dec 13, 2012
app pub date -
Feb 16, 2011
filing date -
Feb 26, 2010
priority date (Note) -
Abandoned
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Abstract
All treatments performed in machining processes other than a polishing process are performed while pure water free from free abrasive grains is supplied. Thus, an amount of abrasive grains included in a used processing liquid discharged in each process is reduced and semiconductor scraps are collected from the used slurry for recycling.
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