Semiconductor Package, Stacking Semiconductor Package, And Method Of Fabricating The Same
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United States of America Patent
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Issued Date -
Dec 13, 2012
app pub date -
May 21, 2012
filing date -
Jun 8, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A stackable semiconductor package, a stacked semiconductor package that uses the stackable semiconductor packages, and a method of fabricating the same. The semiconductor package includes a die paddle unit having a first surface and a second surface opposite to the first surface, a semiconductor die attached to the first surface of the die paddle unit, a plurality of leads each including a first external terminal unit, a second external terminal unit, and a connection lead unit that connects the first external terminal unit to the second external terminal unit, a bonding wire that connects the semiconductor die to the first external terminal unit, and a sealing member formed to expose the first external terminal unit and the second external terminal unit and to surround the semiconductor die and the bonding wire.
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