SILICA PARTICLES, PROCESS FOR PRODUCTION OF SAME, AND RESIN COMPOSITION CONTAINING SAME
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United States of America Patent
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Issued Date -
Dec 6, 2012
app pub date -
Jan 14, 2011
filing date -
Jan 26, 2010
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Abandoned
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Abstract
The object of the present disclosure is to obtain silica particles having the sharp particle size distribution and low water-absorbing rate and being used suitably as a filler of a sealing resin composition, a method for producing it, and a resin composition containing the silica particles and a resin.
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