Proximity Sensor Packaging Structure And Manufacturing Method Thereof
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United States of America Patent
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Issued Date -
Dec 6, 2012
app pub date -
Feb 10, 2011
filing date -
Feb 12, 2010
priority date (Note) -
Abandoned
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Abstract
The present invention pertains to a proximity sensor packaging structure, which comprises a substrate, two first electrically conductive layers and a plurality of second electrically conductive layers that are disposed on the substrate. The substrate has first and second grooves that are respectively defined by a bottom surface and an interior sidewall. Each electrically conductive layer extends from a bottom surface of the first groove, along the interior sidewall of the first groove and in an opposite direction relative to the other first electrically conductive layer, to an exterior sidewall of the substrate. The second electrically conductive layers include first and second electrically conductive portions. The first electrically conductive portion is disposed on a central region of the bottom surface of the second groove. The second electrically conductive portion extends from the bottom surface of the second groove, along the interior sidewall thereof, to the exterior sidewall of the substrate.
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