THERMOELECTRIC DEVICES WITH REDUCTION OF INTERFACIAL LOSSES
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United States of America Patent
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Issued Date -
Dec 6, 2012
app pub date -
Jun 5, 2012
filing date -
Jun 6, 2011
priority date (Note) -
Abandoned
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Abstract
In certain embodiments, a thermoelectric system can include a first thermoelectric assembly and a second thermoelectric assembly. Both the first and second thermoelectric assemblies can be configured to receive heat from at least one heat source and to transmit heat to at least one heat sink. The first and second thermoelectric assemblies can be in electrical communication with one another. The thermoelectric system can further include at least one electrically insulating element mechanically coupled to the first thermoelectric assembly and to the second thermoelectric assembly. The at least one electrically insulating element is not in a thermal path of either (i) heat flow from the at least one heat source to either the first thermoelectric assembly or the second thermoelectric assembly or (ii) heat flow to the at least one heat sink from either the first thermoelectric assembly or the second thermoelectric assembly.
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