DEVICE FOR TREATING SURFACES OF WAFER-SHAPED ARTICLES
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Dec 6, 2012
app pub date -
Jun 1, 2011
filing date -
Jun 1, 2011
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A device for liquid treatment of a wafer-shaped article comprises a closed process chamber, and a ring chuck located within the closed process chamber. The ring chuck is adapted to be driven without physical contact through a magnetic bearing. A magnetic stator surrounds the closed process chamber. The closed process chamber has a cylindrical wall positioned between the ring chuck and the magnetic stator during liquid treatment of a wafer-shaped article. Various structures are provided to prevent upward ingress of processing liquid into a gap defined between the ring chuck and the cylindrical wall.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully