Method for processing rubber surface and sealing member

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United States of America Patent

SERIAL NO

13510672

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Abstract

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A method for processing a rubber surface and a sealing member treated with the method. In the first mode, a rubber surface is formed with a large number of small dimples in a regularly dotted pattern by irradiating laser beams from a laser irradiation device. In the second mode, a skin layer of the rubber surface is removed by irradiating laser beams from the laser irradiation device. In the third mode, the first mode and the third mode are combined. A sealing member comprises rubber including a seal lip part for elastically and slidably contacting a counterpart member, wherein a sliding contact surface of the seal lip part contacting the counterpart member is treated with one of the first, the second and the third modes of the method for processing a rubber surface.

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Patent Owner(s)

Patent OwnerAddress
UCHIYAMA MANUFACTURING CORPOKAYAMA COUNTY JAPAN OKAYAMA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Asanuma, Chihiro Okayama, JP 3 15
Hino, Makoto Okayama, JP 26 323
Katayama, Tatsuo Okayama, JP 24 61
Mitooka, Yutaka Okayama, JP 4 24
Yamamoto, Tomohisa Okayama, JP 43 426
Yokota, Ritsuko Okayama, JP 2 10

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