LED PACKAGE MODULE FOR LIGHTING
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United States of America Patent
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Issued Date -
Nov 29, 2012
app pub date -
Jun 28, 2011
filing date -
May 27, 2011
priority date (Note) -
Abandoned
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Abstract
An LED package module for lighting includes a plurality of LED chips spacedly arranged on a hard substrate and a plurality of dome-shaped encapsulants arranged on the hard substrate in such a way that the encapsulants enclose the LED chips respectively. By means of the dome-shaped encapsulants, the light extracting rate of the LED chips is enhanced. On the surface of the hard substrate, no dam structure is needed; therefore, the amount of the encapsulant material used in the LED package module can be effectively saved.
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