REDUCING AGENT COMPOSITION FOR THE CONDUCTIVE METAL PASTE

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United States of America Patent

APP PUB NO 20120298929A1
SERIAL NO

13577023

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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This is to provide reducing agent composition for a conductive metal paste which improves the pot life of the conductive metal paste and controls fluctuation of a connection resistance value, and a process for preparing the same, and a conductive metal paste.

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Patent Owner(s)

Patent OwnerAddress
NAMICS CORPORATIONNIIGATA-SHI NIIGATA 950-3131

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Mizumura, Noritsuka Niigata-shi, JP 4 18
Yamaguchi, Takashi Niigata-shi, JP 510 6413

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