CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
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United States of America Patent
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Issued Date -
Nov 29, 2012
app pub date -
Mar 8, 2012
filing date -
May 23, 2011
priority date (Note) -
Abandoned
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Abstract
Provided are a circuit board and a method of manufacturing the same which increase a peel strength between a prepreg and a copper plating layer. The method includes: providing a substrate including a first circuit pattern and a first prepreg; forming a plurality of holes on a top surface of the first prepreg; removing silica fillers contained in inner walls of the plurality of holes; and performing copper plating on the top surface of the first prepreg.
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