METHOD AND PROCESS FOR METALLIC STAMP REPLICATION FOR LARGE AREA NANOPATTERNS
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United States of America Patent
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Issued Date -
Nov 29, 2012
app pub date -
Feb 5, 2010
filing date -
Feb 5, 2010
priority date (Note) -
Abandoned
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Abstract
A method and process for obtaining a metal stamp from an intermediate polymer stamp comprising the steps of providing a first print layer on top of a first polymer layer, imprinting structures to obtain an intermediate stamp. A conductive layer is provided on top of the structures to obtain a seed layer if the imprinted polymer is a non-conductive, plating metal on top of the intermediate polymer stamp to obtain a metal stamp then separating the intermediate stamp from the metal stamp. This invention demonstrates stamp replication in high throughput and at low cost.
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